Bostik® B-Component SMP Accelerant Stick

The Bostik® B-Component SMP Accelerant Stick is a specialized surface preparation product designed to accelerate the curing and improve the adhesion of silyl modified polymer (SMP) sealants and adhesives. Formulated for professional bonding applications, it enhances initial tack, speeds cure time, and promotes reliable performance across a wide range of substrates.

• Accelerates curing of SMP sealants and adhesives
• Improves adhesion on challenging or low-energy substrates
• Ideal for surface preparation in construction, marine, and industrial applications
• Easy wipe-on application with convenient stick format
• Supports faster handling and reduced installation time
• Compatible with Bostik® ISR and 70-Series SMP products

Engineered to optimize bonding reliability, the Bostik® B-Component SMP Accelerant Stick is an essential accessory for improving sealant and adhesive performance in demanding environments. Applying the accelerant helps increase initial adhesive strength, reduces cure time, and ensures dependable bonding on metals, plastics, composites, fiberglass, and coated surfaces. Its solid stick format provides fast, controlled application without mess, making it highly practical for field installations, production lines, transportation assembly, marine fabrication, and construction sealing tasks. When used alongside Bostik® SMP sealants and adhesives, this accelerant enhances long-term durability and overall bond performance.

Technical Specifications

• Brand: Bostik®
• Product Type: Accelerant / Surface Preparation Stick
• Technology: SMP (Silyl Modified Polymer) Accelerant
• Compatible Products: Bostik® ISR and 70-Series SMP Sealants & Adhesives
• Application: Wipe-on surface preparation to improve adhesion and cure speed
• Use Cases: Industrial assembly, construction, marine, transportation, OEM manufacturing
• Packaging: Solid accelerant stick format