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LPS® MAX CFC Free NU Low VOC Contact Cleaner, 16 oz

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LPS® MAX CFC Free NU Low VOC Contact Cleaner, 16 oz

 

This residue-free, fast-drying formula contains no chlorinated solvents and is safe on plastics. The low VAC formula removes dirt, moisture, dust, flux, and oxides from the internal components of electronic or precision equipment such as circuit board. Conforms to VOC regulations of CARB, OTC, and LADCO.

FEATURES

  • Meets air quality standards and is plastic-safe
  • Fast evaporating, no residue
  • Does not contain HCFCs
  • Fast-acting and fast penetrating
  • Low odor
  • The nozzle provides targeted or broad stroke application
  • Contoured can for improved hand grip
APPLICATIONS
  • Connectors
  • Contacts
  • Magnetic Tape Heads
  • Printed Circuits
  • Office Equipment
  • Semiconductor Assemblies
  • Switches
  • Telecommunications Equipment
SPECIFICATIONS
  • NSF International: H2
  • MIL-PRF-29608

 

This residue-free, fast-drying formula contains no chlorinated solvents and is safe on plastics. The low VAC formula removes dirt, moisture, dust, flux, and oxides from the internal components of electronic or precision equipment such as circuit board. Conforms to VOC regulations of CARB, OTC, and LADCO.

FEATURES

  • Meets air quality standards and is plastic-safe
  • Fast evaporating, no residue
  • Does not contain HCFCs
  • Fast-acting and fast penetrating
  • Low odor
  • The nozzle provides targeted or broad stroke application
  • Contoured can for improved hand grip
APPLICATIONS
  • Connectors
  • Contacts
  • Magnetic Tape Heads
  • Printed Circuits
  • Office Equipment
  • Semiconductor Assemblies
  • Switches
  • Telecommunications Equipment
SPECIFICATIONS
  • NSF International: H2
  • MIL-PRF-29608
$7.49

Original: $21.39

-65%
LPS® MAX CFC Free NU Low VOC Contact Cleaner, 16 oz

$21.39

$7.49

Description

 

This residue-free, fast-drying formula contains no chlorinated solvents and is safe on plastics. The low VAC formula removes dirt, moisture, dust, flux, and oxides from the internal components of electronic or precision equipment such as circuit board. Conforms to VOC regulations of CARB, OTC, and LADCO.

FEATURES

  • Meets air quality standards and is plastic-safe
  • Fast evaporating, no residue
  • Does not contain HCFCs
  • Fast-acting and fast penetrating
  • Low odor
  • The nozzle provides targeted or broad stroke application
  • Contoured can for improved hand grip
APPLICATIONS
  • Connectors
  • Contacts
  • Magnetic Tape Heads
  • Printed Circuits
  • Office Equipment
  • Semiconductor Assemblies
  • Switches
  • Telecommunications Equipment
SPECIFICATIONS
  • NSF International: H2
  • MIL-PRF-29608

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